Advanced Dicing Technologies

Equipment used in the dicing of Wafers, Hard Material Components, and Package Singulation

  • Dicing Saws

  • Saw Blades (Hub and Hubless)

  • Peripheral Equipment (Water Recycling System, Wafer Cleaner, Spindle Chiller, etc)

  • Dicing Accessories (Frames, Cassettes, Dressing Boards, etc)

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