Semiconductor Equipment Corp

Wafer and Die Processing Tools and Materials

  • Wafer Dicing Tapes - Pressure Sensitive, UV, Heat Release

  • Film Frame Mounters for Dicing, Backgrind, etc. (Manual, SemiAuto and Automatic)

  • Die Bonders

  • UV Exposure System

  • P&P Systems, Die Ejectors, Wafer Die Matrix Expander, etc

  • FOUP and Cassette Cleaning

Click for more information

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