Wafer and Die Processing Tools and Materials

​

• Wafer Dicing Tapes - Pressure Sensitive, UV, Heat Release

• Film Frame Mounters for Dicing, Backgrind, etc. (Manual, SemiAuto and Automatic)

• Die Bonders

• UV Exposure System

• P&P Systems, Die Ejectors, Wafer Die Matrix Expander, etc

• FOUP and Cassette Cleaning

​

Click for more information