Laser Trim Systems

 

• For thick or thin film resistor trim operations to improve precision/performance

• Passive and/or Active Trim options

• Wafer, Panel, or PCB models available

• IR Laser, Green Laser, and UV Laser Options

• Flying Probe or Probe Card test interface

• Extremely flexible design; prototype or high volume production

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Laser Drilling Systems

 

• High throughput Laser Drilling and routing of complex features in flex and ridged HDI PCB’s

• Systems available in Dual Laser (UV + CO2) or standalone UV and CO2 models

• Single Laser systems available in dual-head, dual panel processing configurations.

• Applications Include:

  • Blind Via Drilling

  • Through-hole Via Drilling

  • Buried Via Drilling

  • Cutting, Routing, Patterning

  • Circuit Excising

  • Skiving

  • Cavity Formation

  • Defect Repair

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