PPI Systems Inc.

Laser Trim Systems

For thick or thin film resistor trim operations to improve precision/performance,
Four independent flying probes eliminate need for expensive probe cards. No probe cards also means faster conversion times and increased system flexibility
Extremely flexible design; prototype or high volume production

Laser Drilling Systems

High throughput Laser Drilling and routing of complex features in flex and ridged HDI PCB’s
Systems available in Dual Laser (UV + CO2) or standalone UV and CO2 models
Single Laser systems available in dual-head, dual panel processing configurations.
Applications Include:
- Blind Via Drilling
- Through-hole Via Drilling
- Buried Via Drilling
- Cutting, Routing, Patterning
- Circuit Excising
- Skiving
- Cavity Formation
- Defect Repair