PPI Systems Inc.

Laser Trim Systems


  • For thick or thin film resistor trim operations to improve precision/performance, 

  • No probe card required resulting in fast conversion and reduced trimming costs

  • Extremely flexible design; prototype or high volume production

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Laser Drilling


  • Laser drilling systems optimized for conventional and high performance materials, advanced packaging and embedded components in flex and rigid HDI PCBs

  • Single-laser systems available in dual-head, dual-panel processing configurations

  • Applications Include:

    • Blind Via Drilling

    • Through-hole Via Drilling

    • Buried Via Drilling

    • Cutting, Routing, Patterning

    • Circuit Excising

    • Skiving

    • Cavity Formation

    • Defect Repair

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