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PPI Systems Inc.


Laser Trim Systems


  • For thick or thin film resistor trim operations to improve precision/performance

  • Passive and/or Active Trim options

  • Wafer, Panel, or PCB models available

  • IR Laser, Green Laser, and UV Laser Options

  • Flying Probe or Probe Card test interface

  • Extremely flexible design; prototype or high volume production

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Laser Drilling Systems


  • High throughput Laser Drilling and routing of complex features in flex and ridged HDI PCB’s

  • Systems available in Dual Laser (UV + CO2) or standalone UV and CO2 models

  • Single Laser systems available in dual-head, dual panel processing configurations.

  • Applications Include:

    • Blind Via Drilling

    • Through-hole Via Drilling

    • Buried Via Drilling

    • Cutting, Routing, Patterning

    • Circuit Excising

    • Skiving

    • Cavity Formation

    • Defect Repair

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