PPI Systems Inc.

Laser Trim Systems

For thick or thin film resistor trim operations to improve precision/performance
Passive and/or Active Trim options
Wafer, Panel, or PCB models available
IR Laser, Green Laser, and UV Laser Options
Flying Probe or Probe Card test interface
Extremely flexible design; prototype or high volume production

Laser Drilling Systems

High throughput Laser Drilling and routing of complex features in flex and ridged HDI PCB’s
Systems available in Dual Laser (UV + CO2) or standalone UV and CO2 models
Single Laser systems available in dual-head, dual panel processing configurations.
Applications Include:
- Blind Via Drilling
- Through-hole Via Drilling
- Buried Via Drilling
- Cutting, Routing, Patterning
- Circuit Excising
- Skiving
- Cavity Formation
- Defect Repair